而EMIB-T则在硅桥中引入TSV通孔结构，使得信号可垂直穿越桥接芯片本体，实现更高密度、更短路径的垂直互连。
Фото: U.S. Central Command (@CENTCOM) / Соцсеть X
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const first = await peekFirstChunk(stream);
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